二零一四年台灣平坦化論壇 2014 CMP Forum Taiwan

Presentation on theme: "二零一四年台灣平坦化論壇 2014 CMP Forum Taiwan"— Presentation transcript:

1 二零一四年台灣平坦化論壇 2014 CMP Forum Taiwan
0830~1200 AM, September 5, 2014 台北市南港區經貿二路1號世貿南港展覽館 402C會議室 Taipei World Trade Center Nangang Exhibition Hall Rm 402C 平坦化現在以及超越摩爾定律後的角色 The role of CMP now and beyond Moore’s law 平坦化如何勝任在 1X 技術節點訴求？製程材料與周邊支援技術都須到位，把握機會，聆聽專家對以上議題解決方案的重點，必有收益。 主辦單位 Organized by 協辦單位 Co-Organized by 執行單位 Executed by 收費 Price By 8/21 8/22~9/1 9/5 walk-in CMPUGTW board members (理監事) Free TWD 200 CMPUGTW members (UG個人會員、團體會員) TWD 600 TWD 900 TWD 1000 Non-member (CMP網路會員) USD 30 USD 35 TWD 1200 USD 40

2 Programs are subject to change without prior notice
08:30–08:50 Registration, sign up 08:50-09:00 Opening Remarks: Professor Arthur Chen, National Taiwan University of Science and Technology; Chairman of Board Directors of CMPUGTW. 09:00-10:00 Session 1. Moderator: Dr. Willie Pai/Vice Chairman, KINIK Company 09:00-09:30 Challenges in 1x Design Node Semiconductor Device Cleaning Professor Jingoo Park Hanyang University 09:30-10:00 CMP Applications from Nanometer Scale Features to Microscopic Levels Dr. Yuchun Wang, Vice President of R&D Anji Microelectronics (Shanghai) Co., Ltd. 10:00-10:20 Break 10:20-12:00 Session 2 Moderator. Professor PL Tso, Tsing Hua University 10:20-10:50 The Next Generation Filtration of CMP Slurry with Nanofiber Technology HJ Yang, Director of Application Development Entegris 10:50-11:20 CMP Solutions for 1X Technology Nodes Dr. Marty DeGroot, Asia Technology Director Dow Electronic Materials 11:20-11:50 Novel Colloidal Slurry with High Removal Rate and Low Defect for Bulk Oxide Applications. Dr. James Lin, AP Business Director  Cabot Microelectronics 11:50-12:00 Open discussion 12:00 VIP lunch (invited only) Programs are subject to change without prior notice