長華科技股份有限公司 (6548) 2018/4/11

Disclaimer This presentation has been prepared by CHANG WAH TECHNOLOGY CO., LTD.(the “Company”). This presentation and the materials provided herewith do not constitute an offer to sell or issue or the solicitation of an offer to buy or acquire securities of the Company in any jurisdiction or an inducement to enter into investment activity, nor may it or any part of it form the basis of or be relied on in connection with any contract or commitment whatsoever. Any decision to purchase securities in a proposed offering should be made solely on the basis of the information contained in the offering circular published in relation to such proposed offering, if any. The information contained in this presentation has not been independently verified. No representation, warranty or undertaking, express or implied, is made as to, and no reliance should be placed on, the fairness, accuracy, completeness or correctness of the information or the opinions contained herein. The information contained in this document should be considered in the context of the circumstances prevailing at the time and has not been, and will not be, updated to reflect material developments which may occur after the date of the presentation. None of the Company nor any of its affiliates, advisors or representatives will be liable (in negligence or otherwise) for any loss howsoever arising from any use of this presentation or its contents or otherwise arising in connection with the presentation.

ON Semiconductor 2017 供應商獎 CWTC wins the supplier excellence awards of ON Semiconductor 2017. (http://www.onsemi.com/PowerSolutions/newsItem.do?article=4056) CWTC

大綱 公司簡介 核心技術 車用電子與QFN Wettable Flank封裝 營運績效 未來展望

A.公司簡介

公司基本資料 設立日期 2009年12月24日 董事長 黃嘉能 實收資本額 新台幣3.62億元 員工人數 1,730人(合併) 主要產品 IC Metal Lead Frame、 Pre-Mold Metal Substrate 主要轉投資 SHAP 100% 總公司/工廠 高雄市楠梓加工出口區

公司沿革 2017/12 辦理現金增資5,000千股，資本額3.62億元 2017/10 買下WSP 100%股權以及日本OM廠49%股權 2017/06 再次買下SHAP 40%股權，累計持有SHAP 100%股權 2017/03 買下SHAP 60%股權 2016/09 股票上櫃交易 2014/12 現金增資6,800千股，資本額2.2億 2012/04 EMC產品正式導入量產，並擴增EMC產線自動化設備 2012/01 環氧封膠樹酯(EMC)製程技術開發成功 2009/12 公司設立，從事LED導線架之生產、銷售，資本額1千萬

主要轉投資架構 CWE (8070) CWTC (6548) 45.42% 100% 49% 100% 100% 100% 70% 70% SHAP (Singapore) OM (Japan) CWTC-J (Japan) 100% WSP 70% 70% 100% 100% 100% SHEC (成都) SHPC (成都) SHS (蘇州) MSHE (馬來西亞) SHT (台灣) 30% 30%

B.核心技術

Pre-Mold技術 Pre-mold 關鍵 材料 模具 設計 新製程 (Post Plating)

What is Pre-Mold Structure Conventional QFN L/F Unit Dam Bar Lead Pad Die Pad QFN Pre-Mold L/F Unit EMC Filled Metal(copper) X-Section View

No more bump crack during handling!!! How is Pre-Mold Features No more yield loss by mold flash! No need of back side tape No flash issue on back side when packing Increase W/B UPH! Good wire bondability Solid support for wire bond process FC Bonder /UPH ++ No more bump crack during handling!!! Reliable Flip Chip bondability Solid support for solder joint in F/C application

Pre-Mold Lead Frame Advantage Process Simplification Conventional LF Packing Process LF D/BW/B Back side Taping Molding Tape Removing De-flashing Back side Plating Singulation Pre-Mold LF Packing Process (Remove plating process in Customer side ) PMLF Ni/Pd/Au Post Plated D/B W/B Molding Singulation To reduce PKG total stand off height, reduce LF thickness is KEY. Thinner LF OSATs cannot handle in assembly process…….with pre-mold make it possible! No Wasted water/chemical treatment Reduce Process, Minimize Yield Loss

客製化製程 Process Simplification Wettable Frank QFN 500 I/O (15mm*15mm) Copper plate 1st Etching Plating 1st molding 是否做2nd Molding視製程需求 Process Simplification Copper plate 1st Etching 1st molding 2nd Etching Plating Wettable Frank QFN Copper plate 1st Etching 1st molding 2nd Etching 2nd molding Plating 500 I/O (15mm*15mm)

C. 車用電子 與QFN Wettable Flank封裝

車用電子與QFN Wettable Flank封裝 車用IC大致上可分為微控制器(MCU)、特定應用標準產品(ASSP)/特定應用積體電路(ASIC)、類比(Analog)、功率電晶體(Transistor)、感測器(Sensor)等。(車用半導體年產值逾300億美元)

車用電子特性 車用電子特別要求電子元件的抗候能力，尤其是抗高溫的需求通常會優先於性能與功耗的要求。 除了高溫環境外，電子元件還會面臨衝擊與環境震動等惡劣情況，故封裝設計必須利用相對穩固的引腳設計與焊接面，來強化元件在PCB上的穩固程度。 為確保焊接點有效焊接，車用電子對導線架的要求為「必須以視覺觀察或自動化光學檢測」來確定是否為有效焊接。

QFN(四邊扁平無接腳(Quad Flat No Lead)) QFN體積小，類似CSP(Chip Scale Package)封裝型態，且成本相對便宜，並具有降低熱阻的特性，又因為不需要從四邊引出接腳，所以電性效能極佳，非常適用於中、低腳數的高發熱、高速/高頻系統產品。 焊接特性：QFN採用封裝底面端子作為焊接點，一般很難從其外觀的焊錫點來判斷其焊錫性是否良好，即便 QFN側面仍留有焊腳，但有些只是橫切面並未電鍍，吃錫不易。

Wettable Flank Wettable Flank又稱為可潤濕側翼，用於改進QFN封裝焊接特性，提高可靠性，最更重要的是，透過焊後光學檢測簡化製造過程，直接降低檢測成本。 Wettable Flank大幅提高QFN焊接品質，可符合車用電子的要求 ─ 以目視觀察焊接品質，非常適用於各種汽車電子系統應用。

QFN成長趨勢 2016年使用導線架封裝的IC約佔整體IC封裝的64.2%。

CWTC投入Wettable Flank製程優勢 長華科利用Pre-Mold技術，將經過一次蝕刻的標準QFN基板進行Molding→再做第二次蝕刻→最後電鍍。 也就是直接以第二次蝕刻去刻出台階，形成可潤濕側翼，取代掉封裝廠在Wettable Flank封裝時的額外一倍的切割工序，大幅提高良率、降低成本。

Etching Lead Frame (show 2x2 unit) Top side view Back side view

Molding (show 2x2 unit) Top side view Back side view

2nd etching(show 2x2 unit) Top side view Back side view

Plating (show 2x2 unit) Top side view Back side view

Sawing Show (Unit) A A Top side view Back side view A-A section

D.營運績效

營運績效(合併月營收) 千元NTD

營運績效(合併季損益表)

營運績效(合併年損益表)

2015~2017年合併資產負債表摘要

產品組合(應用別) *依銷售金額(US$)分類 IC：SOP、TSSOP、TSOP、QFP Discrete：SOT

產品組合(製程別) *依銷售金額(US$)分類

E.未來展望

展望與成長動能 擴充QFN產能 推廣Pre-Mold技術、開發Wettable Flank QFN基板 跨足其他應用之蝕刻元件 評估同業購併

Q & A