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CSP Market Prediction Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Kuo-Ning Chiang
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Source:Electronic Trend Publications Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 01/1998 Japan/Korea CSP Status
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Desktop PC Memory Roadmap (Intel) EDO SIMM PC100 SDRAM PC66 SDRAM Direct RDRAM RIMM S-RIMM DIMM High-end Desktop PC Volume Desktop PC Low-cost Desktop PC 199619971998199920002001 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University High Volume Market: Flash Memory, SRAM for Wireless Communication Cost and size driven Motorola has committed BGA for cellular phones, pagers Volume forecast for flash memory (Tessera): –1998200M –1999500M –20001.2B Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Motorola Star Tac cellular phone
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University High Volume Market #2: RDRAM (Rambus) Rambus Licensees: Nintendo (Game), Panasonic and LG Semicon (digital TV), 7 of largest 10 PC makers, Multimedia Appl. (Diamond Multimedia, SGI, etc.), 8 of 10 largest IC makers. Intel Corp. in 1996 announced its intention to use Direct Rambus technology for PC main memory starting in 1999: 1.6 Gb/s of peak bandwidth Intel in 12/97 announced its intention to use BGA as preferred CSP solution for RDRAM Volume forecast: –1999100M –2000700M –20011.4B (40% of total PC market) Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Package Volume Trends (Source: Electronics trend Publications, TechSerach Int.) 19977to 50 M 1998100-700 M 19991,000-1,400 M 20001,800-2,500 M 20012,400-3,500 M Market Share‘98: –Flex CSP (42%) –Wirebond CSP (38%) –Leadframe CSP (12%) BGA packages account for 15% of total CSP market Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Projections-Japan/Korea only Source: NIKKEI MICRODEVICES 2/98 UNITS: millions MWW 6/1/98 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Projections Source: Redpoint Research 4/98 UNITS: millions MWW 6/1/98 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University UNITS: millions MWW 6/1/98 CSP Projections Source: TechSearch International ‘98 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Projections Source: VLSI Research 5/98 UNITS: millions MWW 6/1/98 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Projections Source: Electronics Trend Publications ‘98 MWW 6/1/98 UNITS: millions Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Projections Source:Tessera UNITS: millions MWW 6/1/98 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Source: Tessera Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University MWW 6/14/98 Source: Tessera Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University MWW 6/14/98 Source: Tessera Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University MWW 6/15/98 Source: Tessera Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University MWW 6/15/98 Raw Data for CSP Projections Source: Tessera Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Flash-Market Outlook by CSP Type MWW 6/15/98 Data Source: Electronic Buyers Guide Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University SRAM-Market Outlook by CSP Type MWW 6/15/98 Data Source: Electronic Buyers Guide Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University DRAM-Market Outlook by CSP Type MWW 6/15/98 Data Source: Electronic Buyers Guide Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University MWW 6/15/98 Data Source: Electronic Buyers Guide Merchant-Market Outlook by CSP Type Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University CSP Projections UNITS: millions MWW 6/1/98 Source: Tessera Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室 Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University Electronic Packaging/CAE Labs National Tsing Hua University BGA Volume Prediction in Great China Area 01/98‘ Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室
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