二零一二年台灣平坦化論壇 2012 CMP Forum Taiwan 瞻前顧後 首尾相聯 Watching both Front and Back, Making Immaculate Connection. 3D IC來臨使前端製程與後端製程關係更為緊密。平坦化訴求勢必從晶圓廠進入封測廠，整合任務龐大可觀，此論壇將帶給您珍貴之啟發。 The relationship between front-end and back-end is becoming critically close as 3D IC is emerging. Planarization may be carried all the way from wafer fab even to AT house. The integration is formidable. Join the Forum to gain valuable inspiration. 主辦單位 Organized by 協辦單位 Co-Organized by 執行單位 Executed by 贊助單位 Sponsored by
二零一二年台灣平坦化論壇 2012 CMP Forum Taiwan 0830–0850 Sign up 0850–0900 Opening Remarks: Dr. Arthur Chen/Chairman, CMPUGTW Session 1 Presentation 0900–1000. Host: LC Kong/General Secretary, CMPUGTW 0900–0930 Analysis on Copper Photocorrosion Induced by Illuminance in Chemical Mechanical Planarization Equipment using Photodiode and Quartz Crystal Microbalance Dr. Shohei Shima/Senior Manager, Ebara Corporation. 0930–1000 Advancement of TPU-based CMP Pad Technology Fred Sun/Cabot Microelectronics 1000–1020 Break Session 2 Presentation 1020–1150. Host: Dr. Y.R. Jeng/Vice Principal, National Chung Cheng University 1020–1050 Slurry Development of Fujimi–HKMG CMP & Ru CMP Dr. Kazumi Sugai , General Manager, CMP R&D Dept., FUJIMI INCORPORATED 1050–1120 Recent advances in Ru barrier CMP Lee Cook, Technology Fellow, Dow Chemical Electronic Materials 1120–1150 Critical CMP Part: Victrex® Peek Retaining Ring ST Namgoong Sales & Marketing Manager - Asia Pacific, Victrex 1150–1200 Open discussion 1200 Adjournment/VIP lunch (Invited only) 免費，位置有限，請及早報名。 Free, limited seats, sign up on early. 台北市11568南港區經貿二路1號台北世界貿易中心南港展覽館 5F 504A會議室 Taipei World Trade Center Nangang Exhibition Hall 5F Rm 504A 0830~1200 AM, September 7, 2012