臺灣本土半導體設備 發展過程與未來 蕭恩信 董事長 東 昇 應 材

經濟與產業之關係與趨勢 科技新創途徑-育成中心 資金來源與取得 科技創業之建議

經濟成長與創業活動之關係 既有產業 產業發展，經濟成長 產業 新創事業 升級轉型 結束營業 生存困難 外移 補充 另起爐灶 新興技術導向、高附加價值之中小企業不斷出現 經濟發展正循環

我國產業發展趨勢 產業升級趨動力歷程 創新驅動 (知識) 科技創業 產業升級 投資驅動 (資本) 台灣 現階段 資源驅動 發展年代

產業升級刻不容緩，藉由發展服務業， 再創「台灣奇蹟」－微笑曲線的再闡釋 因應知識經濟的發展在產業價值鏈中自我定位 產業微笑曲線圖 附加價值高 替代性低 創新研發中心 全球運籌管理中心 發展知識密集服務業 製造 組裝 物 流、品 牌、 商 流、行 銷 創 新、市 調、 研 發、 設 計 產業 價值鏈 協助傳統產業轉型 高附加價值產品製造中心 政府核定政策年份 93年 90年 88年 附 加 價 值

創新與再造-市場模式 新創企業尋 求技術協助 創新 育成中心 大學/研究機構 傳統企業轉型 學研機構 Spin-off企業

育成中心內外部資源整合 政府單位 實驗室 育成中心設備 策略聯盟 育成人才 校內專家 研究室 育成資源

育成中心之選定概念

育成資源 活絡新創事業 政府 資金融通

新創事業之資金取得問題 新創事業前景不明，難以取得創投青睞 供給面缺乏資源整合，無法將創新成果轉化為高品質投資案 需求面缺乏組織與整合創業天使，提高新事業的投資效率 創投媒合機制欠缺區域性佈區考量，無法協助解決風險資金，有區域分佈不均的問題

創業投資資金來源 特質型態 出資者 投資對象 個人創業投資家 富有之個人 風險性事業 大公司屬創業 投資部門 大型企業 相關事業或高科技事業 小型企業投資 公司 自有資本/政府貸款 新興中小企業 高科技共同基金 保險基金/退休基金 新興科技企業 投資銀行 銀行/金融機構 新興中小型科技公司

知識型科技創業社會之建議 鼓勵學術界投入本土創業管理之研究，鼓勵知識推廣 跨領域人才之培訓 建構成功創業資料庫，交流分享創業觀點 檢視經營規模發現核心價值 利用知識力與創造力成為競爭優勢 強化產業供應鏈角色

台灣的實例說明

Semiconductor Equipment and Parts Localization in Taiwan Ted Hsiao

Taiwan Semiconductor Industry Infrastructure Taiwan IT Industry Strategy Taiwan’s Semiconductor Industry Cluster Taiwan Foundry Service Taiwan Semiconductor Equipment Industry Equipment Industry Clusters & Labor Support Major Sectors of Taiwan Equipment Industry - Development History - Equipment - Key Components Heading into the 21st Century – Taiwan IT Industry Strategy – Two-trillion & Two-star Industries

Two-trillion + Two-star Industries in Taiwan Taiwan IT Industry Strategy Two-trillion + Two-star Industries in Taiwan The new philosophy of Taiwan’s industrial development of the new millennium will be based upon technology development and research. Two-trillion Industries - Starting from our existing strength and roots in the IC and displays, we will develop global manufacturing and R&D centers around these areas. Two-star Industries – On the other hand, Taiwan has developed great environment for technology innovation & societal application environment. This is key to develop the digital content & bio-technology industries.

Unique Disintegrated Infrastructure in Taiwan Taiwan’s Semiconductor Industry Cluster Unique Disintegrated Infrastructure in Taiwan Equipment / Instruments Capital / Human Resources EDA SIP Service & Support Shipping Customs Science-based Industrial Parks  36 Design Mask Manufacture Packaging Testing 180 4 15 45 15 board Materials Crystal Growing Wafer Slicing 4 Leadframe Wafer Chemicals 8 19 Source: ITIS Project, IEK, ITRI, March 2002

Taiwan Foundry Service Global Customer Base Continues to Expand Long term relationship with fabless companies More DRAM foundry orders from Japan IDMs expand outsourcing More Wafer Capability Forecasted More 12” wafer fabs to be built Taiwan Foundry Service Low Cost High Yield Short Cycle Time Large Capacity Flexible Customer Service

Taiwan Semiconductor Equipment Industry Current Equipment Industry Clusters & Labor Support Major Sectors of Taiwan Equipment Industry Development History Equipment Key Components

Local Production of Semiconductor Equipment (NTD$ Bil.) Opto-electronic equipment 15% Backend 23% Frontend wafer process 19% Parts & components 43% Year 2000 Localization 2.8% 3% 4.6% 6%

R+D & Production of Equipment in Taiwan USA Equipment Market 1,500 3,000 Equipment Production Frontend 20 TL: 90 6,000 Backend Parts & Components 50 R+D Funding Government 10 TL: 30 600 Industry Production / Market 6% 200% R+D Funding / Production - 10% R+D Funding / Market 2% Equipment Demand (Unit: NTD$ billion) ＊R+D by IC foundries are not included.

Industry Clusters & Industrial Parks 元利盛﹑中科院 華東半導體﹑鈦昇﹑盟立﹑弘塑﹑拓技﹑嵩展﹑崇越﹑誠遠﹑恩德﹑聚昌 ﹑力智 晶研科技﹑和立聯合﹑慶康﹑台科半導體﹑台灣應材﹑科林﹑科磊﹑漢民﹑亞泰﹑崇越 台灣應用材料﹑和立聯合 群錄﹑鉅基﹑楊鐵﹑優力特﹑上銀﹑科強﹑台灣暹勁﹑漢翔﹑台翔﹑台灣精銳 均豪﹑榮眾科技 台灣飛利浦﹑公準精密﹑長興化工﹑鈦昇﹑錄海 Frontend Backend/ Others

Local Labor Market Highly educated workforce in Taiwan - Plenty of highly trained technical personnel available for manufacturing purposes. - Design engineers are abound, but need to be trained to handle different manufacturing processes in making semiconductor process equipment. - Many college or trade school graduate workforce available. - Availability of R + D personnel, engineers, and technicians On-the-job training - Special post-school vocational training programs - Cost-sharing Supports - Specific training/educational projects between government and private institutions - Technical education provided by university-industry alliance

Ⅲ-Ⅴ compound semiconductor process eq. Development History – Semicon. Equipment 1996 2000 2002 2006 Frontend Equipment Multi-chamber cluster SPUTTER、ECR Etcher、CMP TFT-LCD vacuum equipment dry & wet clean eq. Wafer reclaim process LPCVD、ETCH、asher、UV passivation Auto. wafer clean & Particle removal eq.、 Eq. SEMI S2 certificate Glass substrate polishing eq. High-k material CVD New wafer materials & ingots、RTP, high precision ingot wire saw、ion implanter components、new process eq. Wire bonder，IC die attach、auto mold、lead cutter、laser engraving、loader/unloader。 IC die attach SMT SMT Chip Mounter Auto mold Laser engraving eq. Dicing eq. Wafer&BGA substrate cutter microBGA Flip chip、CSP、WLP eq.、SOC packaging New device package eq.:3D package、MEMS/Nano device package Semiconductor eq. Component supply chain qualification：quartz、MFC、coating&treatment、mirror polish eq. Module assy、parts cleaning & modification、valve&fitting Mfg qual-precision metal machining、quartz、ceramic、anodizing、EP Semiconductor grade EP gas-lines Vacuum chamber component Dry pump & turbo pump、Filter、MFC、 temp、pressure measurement gage Linear motor、atm & vacuum robot Eq. foundry Electronic panel gas panel RF Generator/Match New component development - TFT-LCD production eq. interface Large wafer size eq. mfg-SPUTTER、PECVD Ⅲ-Ⅴ compound semiconductor process eq. SMT chip mounter、probe card & test eq.、prober、optical substrate test eq.、test probe &sorter、vision inspection、test loader/unloader、BGA substrate test SMIF pod、SMIF Pod Cleaner、AMHS、factory production monitoring system、APC software、wafer transport、PDM Packaging Equipment Sub-assembly Key Component TFT-LCD &Opto-electr. IC Equipment Test Equipment Automation Equipment

Semiconductor Process Equipment Frontend Semiconductor Process Equipment Wafer dicing Wafer reclaim clean Thin film coater Photo litho etch Diffu sion ashing Measure ment & test Process repeat 晶圓切斷 設備 晶圓表面 研磨設備 光阻塗佈 設備 離子摻雜 設備 光阻剝離 設備 晶圓測試 設備 Equipment 清洗設備 薄膜設備 微影設備 蝕刻設備 線切斷機 內周刃切斷機 雙面研磨機 單面研磨機 清洗設備 乾燥裝置  CVD.PVD 氧化設備 磊晶設備 光阻塗佈機 烘烤爐 步進機  EB描畫機 顯影機 乾式蝕刻機 濕式蝕刻機 離子植入機 回火設備 擴散爐 光阻去除機 晶圓測試機 Global Supplier DNS Kaijo TEL AMT Novellus TEL TEL Canon Nikon TEL AMT LAM TEL AMT Eaton Varian PSC Mattson KEM KLA Advantest Teradyne 金敏科技 昇陽半導體 (wafer reclaim & grianding) 拓技科技(wet bench) 弘塑(wet bench)等二十家 晶研科技(CVD) 和立聯合(PVD) 倍強(e-gun evap) 聚昌(e-gun) 亞泰金屬(CMP) 台科(UV passivation) 東台精機、中科院(CMP) 晶研科技 (plasma etch) 慶康(etch) 中科院(plasma eq.) cluster tool+ECR 和立聯合 台科半導體 (PR romover) 上宜雷射 (Excimer laser asher) 鑫測科技 (logic tester) 群立積體電路 (mix-signal tester) 聯測(IC Tester)等數家廠商 Taiwan Supplier Factory Automation 鐠德、外商三家、機械所(SMIF) 群錄(wafer transport) 健昇自動化(eq.electronic control) 上尚科技(material tracking system) 盟立(cleanroom transport) Key Components 科強精密(MFC) 科程科技、東元電機(Chiller,dry & turbo pump) 慶康科技(E-Chuck) 公準、昂承等(metal machining:Wafer Lift) 崇越石英、圓益石英等數家(quartz) 大甲永和、榮科科技(ultraclean gas-line) 榮眾科技、華航、公準(anodize、EP、coating) 機械所(MFC、dry pump) 資料來源：工研院機械所ITIS計畫

Semiconductor Process Equipment Backend Semiconductor Process Equipment Dic-ing Die Bond Bake Wire Bond Mold-ing Plat-ing Engraving Trim Form Test Process Equipment 切割機 半自動切割 全自動切割 黏晶機 LOC黏晶機 LED黏晶機 烘烤機 傳統烤箱 Snap Cure Oven 銲線機 金線銲線機 鋁線銲線機 封膠機 傳統封膠設備 自動封膠機 (Auto Molding) 電鍍設備 掛架式 Auto Plating 蓋印機 油墨蓋印 雷射蓋印 剪切/成型 剪切機 成型機 測試設備 O/S測試 外觀檢測 Global Supplier Disco K&S 東京精密 SEIKO精機 ESEC NEC機械 ASM Alphasem K&S Toshiba 日立東京電子 ESEC ASM Pacific FICO LAMDA K&S 新川 ESEC Kaijo ASM 富士機工 MARKEM LUMONICS 東芝 NEC NEC機械 FICO LAMDA BID Service Fujitsu ASM ASM-FICO Han-Mi PASCON TOWA Intercon KRAS SANTEC TOWA APIC YAMADA FICO ASA 第一精工 ESEC ASM Pacific Lite-On FUJITSU PASCON KOTAKI FICO MICROVISION VISION ENGINEERING NAVITAR Taiwan Supplier 優力特 力智 斯利康 華東(機械所) 冠西 志聖 華東科技 (機械所) 新美化(手動) 京華超音波 (半自動) 基丞 均豪 鉅基 友大 均豪 基丞 盛技 鈦昇 格瑞 均豪 基丞 高工 鉅基 鈦昇 錄海 乘遠 東捷(機械所) 鑫測 柏格 彥亞 資料來源：工研院機械所ITIS計畫

Market is Filled Mostly by Used Equipment Compound Semiconductor Process Equipment Dicing Saw Grinding Clean Thin Film PR Coating Litho Etch Diffu- sion Ashing Inspec- tion Process Oxford Instrument Aixtron etc. Oxford Instrument Aixtron etc. Global Supplier Market is Filled Mostly by Used Equipment Taiwan Supplier 韋僑科技 同上 同上 晶研科技(CVD) 和立聯合(PVD) 慶康(PVD) 倍強(e-gun evap) 亞泰金屬(CMP) 台科(UV passivation) 台中精機 (光學鍍膜) 志聖(LCD光阻塗佈) 晶研科技/Novellus (電漿蝕刻機) 慶康(蝕刻機) 和立聯合 (擴散爐) 台科半導體/PSC (光阻清洗設備) 致茂科技 (邏輯測試機) 等數家廠商

Automation & Components 鐠德、外商三家、機械所 SMIF 群錄 Wafer Transport Systems, AMHS, AGV 健昇自動化 Equipment control modules 上尚科技 Material supply and tracking systems & Equipment control 盟立 AGV,transportation systems Automation 上銀科技 X-y tables, ball screws, linear guide & linear motors 科強精密 MFC 科程科技、東元電機 Chiller、dry pump、turbo pump、equipment power module 慶康科技 E-Chuck 公準、昂承等 specialty metal machining & vacuum components 崇越石英、圓益石英等數家 quartz & ceramic 大甲永和、榮科科技 gas line & gas panel 榮眾科技、華航、公準 anodizing、electropolish、specialty coating Main components vision systems, alignment systems, optical lenses, pin probes, displays & monitors, industrial computer, wire and harness, electric switch boards, PCB towers, pneumatic components, structures, water manifold, piping, MFC, etc.

Infrastructure: Suppliers of Components Take into consideration: Good Knowledge, Better Cost , Good Location, and High Quality Labor Manufacturability (SAP/ERP) and Reliability Machining of metallic components of all sizes is no problem, some of the world's best CNC machine centres are MIT. Based in the Taichung area, but many companies spread out the island Machining large size is no problem: machine centre as large as 5~50 m. Post treatment is also available (such as coating). Anodization is available (smaller than 3 meters). Services available: EP & large ceramic components. Travel within 3~5 hours driving distance

Infrastructure: Suppliers of Components ISO qualified - ISO 9000, 9001, 9002, or 14001 qualified. People are very familiar with the ISO qualified concept. Many smaller manufacturers in Hsin-Chu & Taipei have excellent knowledge about ultra-cleanliness requirement. The sizes of companies ranges quite a bit, anywhere from a 5 person operation to several hundred personnel companies Many have experience working with international customers

Summary Worldwide system suppliers are present in Taiwan either as trade agents or branch offices. Major component suppliers are present in Taiwan either as distributors, trade agents, branch offices, and some local manufacturing. Taiwan local component suppliers are gradually shift to OEM sourcing partners and becoming qualified suppliers. With the driving force of Two-Trillion and Two-Stars, the localization of equipment components speed up.

Two-trillion + Two-star Industries Taiwan IT Industry Strategy Two-trillion + Two-star Industries The new philosophy of Taiwan’s industrial development of the new millennium will be based upon technology development and research. Two-trillion Industries - Starting from our existing strength and roots in the IC and displays, we will develop global manufacturing and R&D centers around these areas. These two industries reach NT$ 1 trillion each by 2006. Two-star Industries – On the other hand, Taiwan has developed great environment for technology innovation & societal application environment. This is key to develop the digital content & bio-technology industries.

聚昌的產品成功實例

LED元件前段製程流程與設備 ITO layer ( E-Gun) P-Electrode ( E-Gun ) MESA Etch ( Etcher ) SiO2 Passivation ( PECVD ) N-GaN N-Electrode ( E-Gun) MQW P-GaN sapphire

聚昌-生產光電元件製程設備 ICP-RIE / RIE E-Beam / Thermal Asher PECVD Sputter LED (III-V Semiconductor) Equipments Photovoltaic Equipments (Solar Cell Puller) MEMS (Bio Chip) Equipments Power Discrete Semiconductor Equipments 聚昌-生產光電元件製程設備 Application ICP-RIE / RIE E-Beam / Thermal Asher PECVD Sputter GaN LED Mesa, Sapphire Etch P-, N- Pad ITO PR Descum Clean SiO2 Mask, Passivation Ni/Au, ITO, SiO2 III-V GaAs AuGe(18K) AuBe Power Discrete Backside Metal Ti/Ni/Ag, Al SixNy Passivation Au MEMS Deep Si Etch Lift-Off Metal Metal Alloy Advanced Package Si Via & Through Hole, BCB etch UBM Multi-Metal

聚昌 – 立基臺灣, 佈局全球。 Nichia, Japan BridgeLux, USA Xepix, USA 1 Nichia, Japan 2 BridgeLux, USA 3 Xepix, USA 4 Samsung E-M, Korea 5 LG Innotek, Korea 6 EPIPLUS, Korea 7 TEHLEDs, Korea 8 KANC, Korea 9 ASTRI, HK

Thank you