二零一四年台灣平坦化論壇 2014 CMP Forum Taiwan 0830~1200 AM, September 5, 2014 台北市南港區經貿二路1號世貿南港展覽館 402C會議室 Taipei World Trade Center Nangang Exhibition Hall Rm 402C 平坦化現在以及超越摩爾定律後的角色 The role of CMP now and beyond Moore’s law 平坦化如何勝任在 1X 技術節點訴求？製程材料與周邊支援技術都須到位，把握機會，聆聽專家對以上議題解決方案的重點，必有收益。 主辦單位 Organized by 協辦單位 Co-Organized by 執行單位 Executed by 收費 Price By 8/21 8/22~9/1 9/5 walk-in CMPUGTW board members (理監事) Free TWD 200 CMPUGTW members (UG個人會員、團體會員) TWD 600 TWD 900 TWD 1000 Non-member (CMP網路會員) USD 30 USD 35 TWD 1200 USD 40
Programs are subject to change without prior notice 08:30–08:50 Registration, sign up 08:50-09:00 Opening Remarks: Professor Arthur Chen, National Taiwan University of Science and Technology; Chairman of Board Directors of CMPUGTW. 09:00-10:00 Session 1. Moderator: Dr. Willie Pai/Vice Chairman, KINIK Company 09:00-09:30 Challenges in 1x Design Node Semiconductor Device Cleaning Professor Jingoo Park Hanyang University 09:30-10:00 CMP Applications from Nanometer Scale Features to Microscopic Levels Dr. Yuchun Wang, Vice President of R&D Anji Microelectronics (Shanghai) Co., Ltd. 10:00-10:20 Break 10:20-12:00 Session 2 Moderator. Professor PL Tso, Tsing Hua University 10:20-10:50 The Next Generation Filtration of CMP Slurry with Nanofiber Technology HJ Yang, Director of Application Development Entegris 10:50-11:20 CMP Solutions for 1X Technology Nodes Dr. Marty DeGroot, Asia Technology Director Dow Electronic Materials 11:20-11:50 Novel Colloidal Slurry with High Removal Rate and Low Defect for Bulk Oxide Applications. Dr. James Lin, AP Business Director Cabot Microelectronics 11:50-12:00 Open discussion 12:00 VIP lunch (invited only) Programs are subject to change without prior notice